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NTD5802N, NVD5802N
Power MOSFET
40 V, Single N ? Channel, 101 A DPAK
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? MSL 1/260 ° C
? AEC Q101 Qualified
? 100% Avalanche Tested
? AEC Q101 Qualified ? NVD5802N
? These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
40 V
http://onsemi.com
R DS(on)
4.4 m W @ 10 V
7.8 m W @ 5.0 V
D
I D
101 A
50 A
Applications
? CPU Power Delivery
? DC ? DC Converters
? Motor Driver
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
S
N ? Channel
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
40
" 20
V
V
4
Continuous Drain Cur-
rent (R q JC ) (Note 1)
T C = 25 ° C
T C = 85 ° C
I D
101
78
A
1 2
3
Power Dissipation
(R q JC ) (Note 1)
Continuous Drain Cur-
rent (R q JA ) (Note 1)
Steady
State
T C = 25 ° C
T A = 25 ° C
T A = 85 ° C
P D
I D
93.75
16.4
12.7
W
A
CASE 369C
DPAK
(Bent Lead)
STYLE 2
Power Dissipation
(R q JA ) (Note 1)
Pulsed Drain Current    t p =10 m s
Current Limited by Package
T A = 25 ° C
T A = 25 ° C
T A = 25 ° C
P D
I DM
I DmaxPkg
2.5
300
45
W
A
A
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
Operating Junction and Storage Temperature
Source Current (Body Diode)
T J , T stg
I S
? 55 to
175
50
° C
A
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche En-
ergy (V DD = 32 V, V GS = 10 V,
L = 0.3 mH, I L(pk) = 40 A, R G = 25 W )
dV/dt
E AS
6.0
240
V/ns
mJ
2
1 Drain 3
Gate Source
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8 ″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Y
WW
5802N
G
= Year
= Work Week
= Device Code
= Pb ? Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 6
1
Publication Order Number:
NTD5802N/D
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